In close cooperation with the business sector, Hahn-Schickard realizes innovative products and technologies in the fields of sensors, intelligent embedded systems for the internet of things, artificial intelligence, lab-on-a-chip and analytics, as well as packaging and interconnection technology and electrochemical energy systems. The range of services includes small, medium and large-scale production.
Role in the project
Hahn-Schickard works on the development of advanced assembly and packaging solutions for sonic and ultrasonic MEMS devices. By that, the system integration of the individual components is done.
Key contribution to the project
By Hahn-Schickard, advanced assembly and packaging solutions will be developed. This includes novel materials, packaging concepts and array technologies. These packages will be tailored according to the use
Researchers
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
Wilhelm-Schickard-Straße 1
78052 Villingen-Schwenningen
GERMANY
www.hahn-schickard.de
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